International Research Journal of Innovations in Engineering and Technology - IRJIET International Open Access, Monthly, Peer Reviewed, Reputed Journal ISSN (online): 2581-3048

Impact Factor (2025): 6.9

DOI Prefix: 10.47001/IRJIET

Investigating Electro-Thermal Coupling in Three-Dimensional Integrated Systems: Simulation Design Advances and Mitigation Strategies

Abstract

Three-dimensional integrated systems employing vertical stacking technology and through-silicon via (TSV) interconnects offer enhanced performance and reduced power consumption. However, TSV technology introduces elector-thermal coupling phenomena, compromising the reliability and efficiency of these systems. This study provides a comprehensive review of simulation design advancements for elector-thermal coupling in TSV-based three-dimensional integrated circuits. Electrical and thermal simulation methodologies are elucidated and potential impacts and mitigation strategies are thoroughly explored. A systematic analysis is presented to elucidate the challenges and optimization opportunities in elector-thermal coupling, informing future research directions.

Country : China / Pakistan

1 Kifayat Ullah2 Atif Rauf Khan3 Nigar Hussain

  1. School of Electrical and Mechanical Engineering, Guilin University of Electronic Technology, Guilin 541004, China
  2. Department of Mechanical Engineering Technology, National Skills University, Islamabad, 44000, Pakistan
  3. School of Information and Communication Engineering, Guilin University of Electronic Technology, Guilin 541004, China

IRJIET, Volume 8, Issue 10, October 2024 pp. 168-177

doi.org/10.47001/IRJIET/2024.810023

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